| 1. | Dimensions of outlines for semiconductor discrete devices
半导体分立器件外形尺寸 |
| 2. | Semiconductor devices - discrete devices - general
半导体器件.分立器件.综述 |
| 3. | Discrete device packaging and its typical types
分立器件封装及其主流类型 |
| 4. | Grading standard of quality for semiconductor discrete devices
半导体分立器件质量分等标准 |
| 5. | Semiconductor devices . discrete devices . part 1 : general
半导体器件.分立器件.第1部分:总则 |
| 6. | Generic apecification for chip for semiconductor discrete devices
半导体分立器件芯片总规范 |
| 7. | Semiconductor devices sectional specification for discrete devices
半导体器件分立器件分规范 |
| 8. | Semiconductor devices - discrete devices - part 4 : microwave devices
半导体器件.分立器件.第4部分:微波器件 |
| 9. | Discrete devices and integrated circuits . part 5 : optoelectronic devices
分立器件和集成电路.第5部分:光电器件 |
| 10. | Semiconductor devices . discrete devices . part 8 : field - effect transistors
半导体器件分立器件第8部分:场效应晶体管 |
